1) ¿ø¸® ¹× ±â´É
ÁõÂø½Ãų Àç·áÀÎ ¼Ò½º(Áõ¹ß¿ø)¸¦ µµ°¡´Ï(Furnace)¿¡ ¿Ã·ÁµÎ°í,°íÁø°øÀ» À¯ÁöÇÑ »óÅ¿¡¼ Àü±âÀû ÀúÇ׿À» ÁÜÀ¸·Î½á Áõ¹ß¿øÀ» ±âÃ¼È ÇÑ´Ù.ÀÌ·¸°Ô Áõ¹ßµÈ ±âü ¿øÀÚ ¹× ºÐÀÚµéÀº ±âÆDZîÁö ³¯¾Æ°¡ ±âÆÇ Ç¥¸é¿¡ ÀÀÃàµÇ¾î ¸ðÀÌ¸é¼ ¹Ú¸·À» Çü¼ºÇÑ´Ù. µµ°¡´Ï¿¡ Àü´ÞµÇ´Â Àü·ù·®À» Á¶ÀýÇÔÀ¸·Î½á ÁõÂø¼Óµµ¸¦ º¯È½Ãų ¼ö ÀÖ´Ù.
2) ±â±âÈ°¿ë
- Æä·Îºê½ºÄ«ÀÌÆ® žçÀüÁö Á¦ÀÛ¿ë ÀüÇϼö¼ÛÃþ,Àü±Ø µîÀ» ¿ÁõÂø
- ÁõÂø °¡´É ¹°Áú : C60, BCP, LiF, Au, Cu
- Á÷Á¢»ç¿ë ºÒ°¡,Á¶ÀÛ´ëÇุ °¡´É
- ÆÐÅϸ¶½ºÅ© (¾ø´Â°æ¿ì) º°µµ Á¦ÀÛ ÇÊ¿ä (¹®ÀÇ)
3) »ç¾ç
- Sample size & throughput : Up to150 mm x 150 mmsquare
- Loading capacity : Depend on sample size (25 mm x 25 mm (16ea),50 mm x 50 mm (4ea), 150 mm x 150 mm (1ea), ±âŸ ¹®ÀÇ)
- Sample rotation speed : 5 rpm
- Thermal power supply : 1.5kW (5V / 300A)
- Substrate heater : None
- Load-lock chamber : Back-bone type
- Deposition control : Automatic film thickness control
- Ultimate pressure : ≤ 7×10-7Torr
- Vacuum pump : Cryo pump + Rotary pump
- Process control : Manual/Auto process control
4) Àåºñȸ»ç ȨÆäÀÌÁö
http://www.ultech.co.kr/
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